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Micron patent applications published on 28 December 2006
Thursday December 28th 2006, 8:25 am
Filed under: Micron, Patent Applications

38 US patent applications published on 28 December 2006 and assigned to Micron

1 20060292875 Method for enhancing electrode surface area in DRAM cell capacitors
2 20060292873 Unsymmetrical ligand sources, reduced symmetry metal-containing compounds, and systems and methods including same
3 20060292858 Techniques to create low K ILD for beol
4 20060292857 METHODS FOR MAKING INTEGRATED-CIRCUIT WIRING FROM COPPER, SILVER, GOLD, AND OTHER METALS
5 20060292841 Atomic layer deposition systems and methods including metal beta-diketiminate compounds
6 20060292838 Ion implanting methods
7 20060292788 Systems and methods of forming refractory metal nitride layers using disilazanes
8 20060292786 Semiconductor constructions, and methods of forming semiconductor constructions
9 20060292767 STORAGE DEVICES FORMED ON PARTIALLY ISOLATED SEMICONDUCTOR SUBSTRATE ISLANDS
10 20060292750 Standoffs for centralizing internals in packaging process
11 20060292746 Stacked die in die BGA package
12 20060292745 Stacked die in die BGA package
13 20060292743 Stacked die in die BGA package
14 20060292735 Methods for creating gapless inner microlenses, arrays of microlenses, and imagers having same
15 20060292303 Beta-diketiminate ligand sources and metal-containing compounds thereof, and systems and methods including same
16 20060291312 CMOS amplifiers with frequency compensating capacitors
17 20060291280 Configuration finalization on first valid NAND command
18 20060290438 MICROSTRIP LINE DIELECTRIC OVERLAY
19 20060290001 Interconnect vias and associated methods of formation
20 20060289993 Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow
21 20060289992 Stacked semiconductor component, fabrication method and fabrication system
22 20060289990 APPARATUS AND METHOD FOR HIGH DENSITY MULTI-CHIP STRUCTURES
23 20060289989 Intrinsic thermal enhancement for FBGA package
24 20060289969 LASER ASSISTED MATERIAL DEPOSITION
25 20060289968 Conductive interconnect structures and formation methods using supercritical fluids
26 20060289956 Process for creating tilted microlens
27 20060289952 Method of composite gate formation
28 20060289951 Method of composite gate formation
29 20060289950 Method of composite gate formation
30 20060289949 Method of composite gate formation
31 20060289927 Non-volatile memory with hole trapping barrier
32 20060289923 Oxide epitaxial isolation
33 20060289918 Low resistance peripheral local interconnect contacts with selective wet strip of titanium
34 20060289914 Semiconductor constructions, memory cells, DRAM arrays, electronic systems; methods of forming semiconductor constructions; and methods of forming DRAM arrays
35 20060289902 Method for forming raised structures by controlled selective epitaxial growth of facet using spacer
36 20060289389 Poly etch without separate oxide decap
37 20060289033 METHOD OF CLEANING SEMICONDUCTOR SURFACES
38 20060288937 LASER ASSISTED MATERIAL DEPOSITION