30 US patents granted on 27 February 2007 and assigned to Micron
| 1 | 7,185,173 | Column address path circuit and method for memory devices having a burst access mode |
| 2 | 7,185,154 | Single segment data object management |
| 3 | 7,184,551 | Public key cryptography using matrices |
| 4 | 7,184,352 | Memory system and method using ECC to achieve low power refresh |
| 5 | 7,184,329 | Alignment of memory read data and clocking |
| 6 | 7,184,327 | System and method for enhanced mode register definitions |
| 7 | 7,184,315 | NROM flash memory with self-aligned structural charge separation |
| 8 | 7,184,312 | One transistor SOI non-volatile random access memory cell |
| 9 | 7,184,292 | High speed data bus |
| 10 | 7,184,284 | Closed-loop high voltage booster |
| 11 | 7,183,792 | Method and system for detecting a mode of operation of an integrated circuit, and a memory device including same |
| 12 | 7,183,790 | System and method for testing devices utilizing capacitively coupled signaling |
| 13 | 7,183,621 | MRAM memory cell having an electroplated bottom layer |
| 14 | 7,183,611 | SRAM constructions, and electronic systems comprising SRAM constructions |
| 15 | 7,183,531 | Amplification with feedback capacitance for photodetector signals |
| 16 | 7,183,485 | Microelectronic component assemblies having lead frames adapted to reduce package bow |
| 17 | 7,183,220 | Plasma etching methods |
| 18 | 7,183,208 | Methods for treating pluralities of discrete semiconductor substrates |
| 19 | 7,183,194 | Method of forming socket contacts |
| 20 | 7,183,191 | Method for fabricating a chip scale package using wafer level processing |
| 21 | 7,183,185 | Methods of forming transistor gates; and methods of forming programmable read-only memory constructions |
| 22 | 7,183,164 | Methods of reducing floating body effect |
| 23 | 7,183,138 | Method and apparatus for decoupling conductive portions of a microelectronic device package |
| 24 | 7,183,134 | Ultrathin leadframe BGA circuit package |
| 25 | 7,183,133 | Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices |
| 26 | 7,182,979 | High efficiency method for performing a chemical vapordeposition utilizing a nonvolatile precursor |
| 27 | 7,182,669 | Methods and systems for planarizing workpieces, e.g., microelectronic workpieces |
| 28 | 7,182,668 | Methods for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
| 29 | 7,182,241 | Multi-functional solder and articles made therewith, such as microelectronic components |
| 30 | 7,181,837 | Plating buss and a method of use thereof |
