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Matsushita patent applications published on 31 May 2007
Thursday May 31st 2007, 9:55 am
Filed under: Matsushita, Patent Applications

27 US patent applications published on 31 May 2007 and assigned to Matsushita

1 20070124714 Method for designing semiconductor integrated circuit layout
2 20070124643 Method, encoder and communication device for encoding parallel concatenated data
3 20070123777 Ultrasonic diagnostic apparatus
4 20070123321 TELEPHONE APPARATUS
5 20070123236 Optimized transmission of text sample format description for streaming timed text
6 20070123186 RADIO-FREQUENCY RECEIVER
7 20070122715 Lithium ion secondary battery
8 20070122708 Negative electrode material for non-aqueous electrolyte secondary battery, method for producing the same and non-aqueous electrolyte secondary battery
9 20070122214 Fixing apparatus
10 20070121930 Communication apparatus and communication method
11 20070121738 Transmission apparatus and peak suppression method
12 20070121737 Transmission apparatus and peak suppression method
13 20070121676 Communication apparatus, integrated circuit, and communication method
14 20070121542 Quality-of-service (qos)-aware scheduling for uplink transmission on dedicated channels
15 20070121528 COMMUNICATION APPARATUS
16 20070121258 SWITCHING POWER SUPPLY AND SEMICONDUCTOR DEVICE USED THEREFOR
17 20070121039 LIQUID CRYSTAL DISPLAY DEVICE
18 20070120953 Communication apparatus, communication system, image capture apparatus, video capture apparatus, and setting method thereof
19 20070120784 SEMICONDUCTOR CIRCUITS FOR DRIVING CURRENT-DRIVEN DISPLAY AND DISPLAY
20 20070120775 Microcontroller for driving vacuum fluorescent display
21 20070120617 Modulation apparatus and modulation method
22 20070120272 Electronic component and manufacturing method of the electronic component
23 20070120235 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
24 20070119993 Electrostatically atomizing device
25 20070119841 Welding system and consumable electrode welding method
26 20070119617 Method for manufacturing component built-in module, and component built-in module
27 20070119614 WIRING BOARD AND METHOD FOR PRODUCING THE SAME