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Intel patents granted on 31 July 2007
Tuesday July 31st 2007, 11:19 am
Filed under: Intel, Patents

28 US patents granted on 31 July 2007 and assigned to Intel

1 7,251,824 Accessing a private network
2 7,251,811 Controlling compatibility levels of binary translations between instruction set architectures
3 7,251,755 Apparatus and method for maintaining data integrity following parity error detection
4 7,251,740 Apparatus coupling two circuits having different supply voltage sources
5 7,251,739 System and method for sequencing multiple write state machines
6 7,251,723 Fault resilient booting for multiprocessor system using appliance server management
7 7,251,704 Store and forward switch device, system and method
8 7,251,671 Method and system for garbage collection wherein resetting the mark/allocation bit, and switching the mark/allocation bit to the mark bit to perform marking and scanning of objects using the identified object as a root object and providing mark/allocation bit information being displayed at the client
9 7,251,389 Embedded on-die laser source and optical interconnect
10 7,251,350 Method and apparatus for adaptive realtime system power state control
11 7,251,292 Technique and apparatus for low power wireless communication
12 7,251,282 Receiver and method to detect and synchronize with a symbol boundary of an OFDM symbol
13 7,251,233 Call routing in a location-aware network
14 7,251,226 Communication system with fast control traffic
15 7,251,224 Communications meshes
16 7,251,219 Method and apparatus to communicate flow control information in a duplex network processor system
17 7,251,139 Thermal management arrangement for standardized peripherals
18 7,251,128 Adjustable portable computer
19 7,251,127 Convertible and detachable laptops
20 7,250,815 Amplifier distortion management apparatus, systems, and methods
21 7,250,792 High speed differential pre-driver using common mode pre-charge
22 7,250,783 Current mirror multi-channel leakage current monitor circuit and method
23 7,250,684 Circular wire-bond pad, package made therewith, and method of assembling same
24 7,250,678 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
25 7,250,366 Carbon nanotubes with controlled diameter, length, and metallic contacts
26 7,250,333 Method of fabricating a linearized output driver and terminator
27 7,250,327 Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism
28 7,249,955 Connection of package, board, and flex cable