28 US patents granted on 31 July 2007 and assigned to Micron
| 1 | 7,251,762 | On-chip sampling circuit and method |
| 2 | 7,251,715 | Double data rate scheme for data output |
| 3 | 7,251,714 | Method and system for capturing and bypassing memory transactions in a hub-based memory system |
| 4 | 7,251,711 | Apparatus and methods having a command sequence |
| 5 | 7,251,618 | Method and system for purchasing a memory upgrade for a computer system |
| 6 | 7,251,387 | Optical integrated circuit and method for fabricating the same |
| 7 | 7,251,194 | Memory system and method for strobing data, command and address signals |
| 8 | 7,251,187 | Memory system, method and predecoding circuit operable in different modes for selectively accessing multiple blocks of memory cells for simultaneous writing or erasure |
| 9 | 7,251,181 | Techniques for storing accurate operating current values |
| 10 | 7,251,177 | Skewed sense AMP for variable resistance memory sensing |
| 11 | 7,251,173 | Combination column redundancy system for a memory array |
| 12 | 7,251,154 | Method and apparatus providing a cross-point memory array using a variable resistance memory cell and capacitance |
| 13 | 7,250,798 | Synchronous clock generator including duty cycle correction |
| 14 | 7,250,789 | Pseudo-CMOS dynamic logic with delayed clocks |
| 15 | 7,250,780 | Probe card for semiconductor wafers having mounting plate and socket |
| 16 | 7,250,687 | Systems for degating packaged semiconductor devices with tape substrates |
| 17 | 7,250,680 | Semiconductor circuitry constructions |
| 18 | 7,250,663 | Frame scale package using contact lines through the elements |
| 19 | 7,250,647 | Asymmetrical transistor for imager device |
| 20 | 7,250,628 | Memory devices and electronic systems comprising thyristors |
| 21 | 7,250,591 | Photonic crystal-based filter for use in an image sensor |
| 22 | 7,250,380 | Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry |
| 23 | 7,250,378 | Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry |
| 24 | 7,250,367 | Deposition methods using heteroleptic precursors |
| 25 | 7,250,338 | Scalable Flash/NV structures and devices with extended endurance |
| 26 | 7,250,328 | Microelectronic component assemblies with recessed wire bonds and methods of making same |
| 27 | 7,250,321 | Method of forming a photosensor |
| 28 | 7,250,247 | Photolithographic structures using multiple anti-reflecting coatings |
