31 US patents granted on 05 August 2008 and assigned to Intel
| 1 | 7,409,631 | Error-detection flip-flop |
| 2 | 7,409,621 | On-chip jitter testing |
| 3 | 7,409,594 | System and method to detect errors and predict potential failures |
| 4 | 7,409,575 | Recovery of computer systems |
| 5 | 7,409,568 | Power supply voltage droop compensated clock modulation for microprocessors |
| 6 | 7,409,542 | Security association management through the use of lookup tables |
| 7 | 7,409,516 | Pending request scoreboard for out-of-order memory scheduler |
| 8 | 7,409,483 | Methods and apparatuses to provide message signaled interrupts to level-sensitive drivers |
| 9 | 7,409,400 | Applications of an appliance in a data center |
| 10 | 7,409,370 | Secured and selective runtime auditing services using a trusted computing device |
| 11 | 7,409,197 | Transceiver with receive path overload protection and method |
| 12 | 7,409,189 | Calibration and testing architecture for receivers |
| 13 | 7,409,021 | Voltage controller for a highly linear phase interpolator |
| 14 | 7,409,002 | Signal modulation |
| 15 | 7,408,932 | Method and apparatus for two-stage packet classification using most specific filter matching and transport level sharing |
| 16 | 7,408,909 | Method and apparatus to enable multiple receivers |
| 17 | 7,408,908 | Variable SDMA ACK timeout |
| 18 | 7,408,887 | Methods and apparatus for operating a wireless electronic device based on usage pattern |
| 19 | 7,408,797 | Methods and apparatus for content addressable memory arrays including shared match lines |
| 20 | 7,408,787 | Phase change thermal interface materials including polyester resin |
| 21 | 7,408,506 | Method and apparatus for conserving power on a mobile device through motion awareness |
| 22 | 7,408,463 | Radio frequency identification tag |
| 23 | 7,408,420 | Multi mode clock generator |
| 24 | 7,408,409 | Amplifier circuit with cross-coupled cascode transistors |
| 25 | 7,408,179 | Transition radiation apparatus and method therefor |
| 26 | 7,407,878 | Method of providing solder bumps on a substrate using localized heating |
| 27 | 7,407,868 | Chemical thinning of silicon body of an SOI substrate |
| 28 | 7,407,847 | Stacked multi-gate transistor design and method of fabrication |
| 29 | 7,407,819 | Polymer memory having a ferroelectric polymer memory material with cell sizes that are asymmetric |
| 30 | 7,407,085 | Apparatus and method for attaching a semiconductor die to a heat spreader |
| 31 | 7,407,070 | Fastener installation tool |
