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Intel patent applications published on 14 August 2008
Thursday August 14th 2008, 9:00 am
Filed under: Intel, Patent Applications

2 US patent applications published on 14 August 2008 and assigned to Intel

1 20080192559 Bank interleaving compound commands
2 20080191358 SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL