3 US patent applications published on 27 April 2006 and assigned to Hewlett-Packard
| 1 | 20060088981 | Wafer packaging and singulation method |
| 2 | 20060087872 | Power supply including multiple AC receptacles |
| 3 | 20060087541 | Reactive color inks |
Hewlett-Packard patent applications published on 27 April 2006
