27 US patent applications published on 03 March 2016 and assigned to Hitachi
| 1 | 20160065678 | COMMUNICATION SYSTEM, MANAGEMENT COMPUTER, AND SESSION INFORMATION MIGRATION METHOD |
| 2 | 20160065660 | COMPUTER SYSTEM, COMPUTER, AND LOAD BALANCING METHOD |
| 3 | 20160065210 | SEMICONDUCTOR DEVICE |
| 4 | 20160065030 | ELECTRIC DRIVE DEVICE AND ELECTRIC POWER STEERING DEVICE |
| 5 | 20160065020 | Axial-Type Rotary Electric Machine |
| 6 | 20160064779 | LITHIUM ION BATTERY SYSTEM |
| 7 | 20160064219 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM |
| 8 | 20160064189 | PLASMA PROCESSING APPARATUS |
| 9 | 20160064111 | ELECTRON BEAM IRRADIATION APPARATUS |
| 10 | 20160064099 | SEMICONDUCTOR DEVICE AND ITS QUALITY MANAGEMENT METHOD |
| 11 | 20160064080 | SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING DEVICE |
| 12 | 20160064053 | SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING DEVICE |
| 13 | 20160064050 | SEMICONDUCTOR DEVICE |
| 14 | 20160063793 | PAPER MONEY HANDLING APPARATUS |
| 15 | 20160063725 | SEMICONDUCTOR DEVICE, IMAGE SEGMENTATION METHOD, AND IMAGE PROCESSOR |
| 16 | 20160063391 | INFORMATION PROCESSING SYSTEM AND MANAGEMENT APPARATUS |
| 17 | 20160063148 | SEMICONDUCTOR DEVICE |
| 18 | 20160062951 | SEMICONDUCTOR DEVICE |
| 19 | 20160062844 | COMPUTER SYSTEM FOR BACKING UP DATA |
| 20 | 20160062704 | SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING DEVICE |
| 21 | 20160062328 | Broad Area Management System, Broad Area Management Apparatus, Building Management Apparatus, and Broad Area Management Method |
| 22 | 20160061172 | RUNNING CONTROL APPARATUS AND RUNNING CONTROL SYSTEM |
| 23 | 20160061066 | VALVE TIMING CONTROL DEVICE OF INTERNAL COMBUSTION ENGINE |
| 24 | 20160060840 | CONSTRUCTION EQUIPMENT |
| 25 | 20160060755 | SUBSTRATE PROCESSING APPARATUS |
| 26 | 20160060174 | SEMICONDUCTOR CERAMIC COMPOSITION, METHOD FOR PRODUCING SAME, PTC ELEMENT AND HEAT GENERATING MODULE |
| 27 | 20160060158 | LEAD-FREE LOW-MELTING GLASS COMPOSITION, LOW-TEMPERATURE SEALING GLASS FRIT, LOW-TEMPERATURE SEALING GLASS PASTE, CONDUCTIVE MATERIAL, AND CONDUCTIVE GLASS PASTE CONTAINING GLASS COMPOSITION, AND GLASS-SEALED COMPONENT AND ELECTRIC/ELECTRONIC COMPONENT PREPARED USING THE SAME |
