31 US patents granted on 24 January 2006 and assigned to Hitachi
| 1 | 6,990,605 | Methods and apparatus for recovering work of one computer by another computers |
| 2 | 6,990,584 | Method of and apparatus for restricting copy of digital information, and apparatus for recording digital information |
| 3 | 6,990,553 | Method of controlling storage device controlling apparatus, and storage device controlling apparatus |
| 4 | 6,990,351 | Equipment for the calculation of mobile handset position |
| 5 | 6,990,345 | Method and apparatus for wireless position location |
| 6 | 6,990,294 | Optical network system with quality control function |
| 7 | 6,990,231 | Method and apparatus for forming and displaying projection image from a plurality of sectional images |
| 8 | 6,990,133 | Laser diode and manufacturing method thereof |
| 9 | 6,990,002 | Semiconductor device |
| 10 | 6,989,971 | Giant magnetoresistance (GMR) read head with reactive-ion-etch defined read width and fabrication process |
| 11 | 6,989,969 | Integrated lead suspension and method of construction |
| 12 | 6,989,964 | Magnetic head having a pole piece with a double pedestal structure |
| 13 | 6,989,958 | Screw attachment from exterior of disk drive enclosure for motors with mount bracket screw bolt pattern diameter larger than the motor hub outside diameter |
| 14 | 6,989,957 | Disk storage device |
| 15 | 6,989,952 | Magnetic recording disk drive with laminated media and improved media signal-to-noise ratio |
| 16 | 6,989,881 | Display device with signal line extended from display area to peripheral area being covered in peripheral area |
| 17 | 6,989,844 | Image display |
| 18 | 6,989,599 | Semiconductor device with layered interconnect structure |
| 19 | 6,989,550 | Distributed feedback semiconductor laser equipment employing a grating |
| 20 | 6,989,535 | Atomic force microscopy, method of measuring surface configuration using the same, and method of producing magnetic recording medium |
| 21 | 6,989,531 | Mass spectrometer |
| 22 | 6,989,415 | Modified fluoroplastic composition and modified fluoroplastic molded article |
| 23 | 6,989,334 | Manufacturing method of a semiconductor device |
| 24 | 6,989,329 | Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections |
| 25 | 6,989,287 | Method for producing nitride semiconductor, semiconductor wafer and semiconductor device |
| 26 | 6,989,228 | Method and apparatus for processing samples |
| 27 | 6,989,218 | Composite electrode material and method for producing the same, and electrochemical element using the same |
| 28 | 6,989,212 | Fuel cell, polyelectrolyte and ion-exchange resin used for same |
| 29 | 6,988,668 | IC card and method of manufacturing the same |
| 30 | 6,988,399 | Physical quantity detecting device having second lead conductors connected to the electrodes and extending to the circumference of the substrate |
| 31 | RE38,944 | Semiconductor memory |
