1 US patent application published on 26 August 2010 and assigned to Intel
| 1 | 20100213581 | DIELECTRIC FILM WITH LOW COEFFICIENT OF THERMAL EXPANSION (CTE) USING LIQUID CRYSTALLINE RESIN |
1 US patent application published on 26 August 2010 and assigned to Intel
| 1 | 20100213581 | DIELECTRIC FILM WITH LOW COEFFICIENT OF THERMAL EXPANSION (CTE) USING LIQUID CRYSTALLINE RESIN |