2 US patent applications published on 29 January 2009 and assigned to Intel
| 1 | 20090027992 | PSRAM AND METHOD FOR OPERATING THEREOF |
| 2 | 20090025882 | DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURABLE TAPE |
2 US patent applications published on 29 January 2009 and assigned to Intel
| 1 | 20090027992 | PSRAM AND METHOD FOR OPERATING THEREOF |
| 2 | 20090025882 | DIE MOLDING FOR FLIP CHIP MOLDED MATRIX ARRAY PACKAGE USING UV CURABLE TAPE |