Intel patents granted on 26 June 2007

33 US patents granted on 26 June 2007 and assigned to Intel

1 7,237,209 Integrated circuit design and testing
2 7,237,131 Transaction-based power management in a computer system
3 7,237,128 Method and apparatus to dynamically change an operating frequency and operating voltage of an electronic device
4 7,237,113 Keyed authentication rollover for routers
5 7,237,102 Methods and apparatus for configuring hardware resources in a pre-boot environment without requiring a system reset
6 7,237,064 Method and apparatus for feedback-based management of combined heap and compiled code caches
7 7,237,051 Mechanism to control hardware interrupt acknowledgement in a virtual machine system
8 7,237,042 Mechanism for generating a virtual identifier
9 7,236,920 Mechanism for estimating and controlling di/dt-induced power supply voltage variations
10 7,236,790 Distributed radar detection for WLAN
11 7,236,760 Tuner for reception of a broadband radio frequency signal
12 7,236,753 Direct outphasing modulator
13 7,236,748 Closed loop feedback in MIMO systems
14 7,236,666 On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical device
15 7,236,648 Scaling images for display
16 7,236,599 Generating separate analog audio programs from a digital link
17 7,236,518 Deskewing differential repeater
18 7,236,500 Demodulation of multi-user, multi-protocol data in a reconfigurable datapath
19 7,236,499 Resource arbitration in accordance with a masked request vector
20 7,236,497 Facilitating arbitration via information associated with groups of requesters
21 7,236,457 Load balancing in a network
22 7,236,410 Memory cell driver circuits
23 7,236,059 Apparatus, system, and method for oscillator network with multiple parallel oscillator circuits
24 7,236,045 Bias generator for body bias
25 7,236,032 Ultra-drowsy circuit
26 7,236,005 Majority voter circuit design
27 7,235,886 Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby
28 7,235,880 IC package with power and signal lines on opposing sides
29 7,235,843 Implanting carbon to form P-type source drain extensions
30 7,235,809 Semiconductor channel on insulator structure
31 7,235,478 Polymer spacer formation
32 7,235,344 Energy harvesting molecules and photoresist technology
33 7,234,947 Electrical socket with compressible domed contacts