Intel patents granted on 29 May 2007

41 US patents granted on 29 May 2007 and assigned to Intel

1 7,225,441 Mechanism for providing power management through virtualization
2 7,225,434 Method to collect address trace of instructions executed
3 7,225,370 Eye width characterization mechanism
4 7,225,350 Active state link power management
5 7,225,349 Power supply voltage droop compensated clock modulation for microprocessors
6 7,225,347 Method and apparatus for enabling a low power mode for a processor
7 7,225,332 Methods and apparatus to perform cryptographic operations on received data
8 7,225,326 Hardware assisted ATA command queuing
9 7,225,318 Dynamic prefetch in continuous burst read operation
10 7,225,316 Memory mapping apparatus, systems, and methods
11 7,225,281 Multiprocessor infrastructure for providing flexible bandwidth allocation via multiple instantiations of separate data buses, control buses and support mechanisms
12 7,225,247 Serial port redirection using a management controller
13 7,225,245 Remote diagnostics system
14 7,224,981 Speech recognition of mobile devices
15 7,224,830 Gesture detection from digital video images
16 7,224,739 Controlled frequency signals
17 7,224,724 Reduced alphabet equalizer using iterative equalization
18 7,224,571 Forming a substrate core with embedded capacitor and structures formed thereby
19 7,224,225 Differential inductor based low noise amplifier
20 7,224,203 Analog voltage distribution on a die using switched capacitors
21 7,224,075 Methods and systems for attaching die in stacked-die packages
22 7,224,067 Intermetallic solder with low melting point
23 7,224,059 Method and apparatus for thermo-electric cooling
24 7,224,050 Plastic materials including dendrimers or hyperbranched polymers for integrated circuit packaging
25 7,223,992 Thermal conducting trench in a semiconductor structure
26 7,223,705 Ambient gas treatment of porous dielectric
27 7,223,701 In-situ sequential high density plasma deposition and etch processing for gap fill
28 7,223,695 Methods to deposit metal alloy barrier layers
29 7,223,694 Method for improving selectivity of electroless metal deposition
30 7,223,685 Damascene fabrication with electrochemical layer removal
31 7,223,679 Transistor gate electrode having conductor material layer
32 7,223,660 Flash assisted annealing
33 7,223,650 Self-aligned gate isolation
34 7,223,638 Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
35 7,223,633 Method for solder crack deflection
36 7,223,631 Windowed package having embedded frame
37 7,223,629 Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
38 7,223,613 Ferroelectric polymer memory with a thick interface layer
39 7,223,448 Methods for providing uniformity in plasma-assisted material processes
40 7,223,027 Optical communications adapter module configured for use inside a XENPAK-sized module
41 7,222,403 Pad gripping and removal apparatuses