29 US patents granted on 29 September 2009 and assigned to Intel
| 1 | 7,596,790 | Allocating computing resources in a distributed environment |
| 2 | 7,596,783 | Methods and apparatus to implement annotation based thunking |
| 3 | 7,596,724 | Quiescence for retry messages on bidirectional communications interface |
| 4 | 7,596,714 | Methods and apparatus to manage throttling in computing environments |
| 5 | 7,596,709 | CPU power management based on utilization with lowest performance mode at the mid-utilization range |
| 6 | 7,596,683 | Switching processor threads during long latencies |
| 7 | 7,596,662 | Selective storage of data in levels of a cache memory |
| 8 | 7,596,653 | Technique for broadcasting messages on a point-to-point interconnect |
| 9 | 7,596,652 | Integrated circuit having processor and bridging capabilities |
| 10 | 7,596,650 | Increasing availability of input/output (I/O) interconnections in a system |
| 11 | 7,596,638 | Method, system, and apparatus to decrease CPU temperature through I/O bus throttling |
| 12 | 7,596,464 | Determining the thermal influence of components within a system and usage of a matrix for power and thermal management |
| 13 | 7,596,384 | Audio over subsystem interface |
| 14 | 7,596,371 | Device, system, and method of selectively scanning a wireless communication band |
| 15 | 7,596,355 | System and method capable of closed loop MIMO calibration |
| 16 | 7,596,174 | Equalizing a transmitter |
| 17 | 7,596,152 | Apparatus, system and method capable of low duty cycle hierarchical AD HOC networks |
| 18 | 7,596,141 | Packet classification using encoded addresses |
| 19 | 7,595,991 | Using the wave soldering process to attach motherboard chipset heat sinks |
| 20 | 7,595,856 | Black and white color cholesteric liquid crystal display |
| 21 | 7,595,820 | Determining image quality for improving object trackability |
| 22 | 7,595,768 | Switching schemes for multiple antennas |
| 23 | 7,595,698 | PLL lock time reduction |
| 24 | 7,595,555 | Method of forming air gaps in a dielectric material using a sacrificial film and resulting structures |
| 25 | 7,595,468 | Passive thermal solution for hand-held devices |
| 26 | 7,595,248 | Angled implantation for removal of thin film layers |
| 27 | 7,595,203 | Ferroelectric memory device with a conductive polymer layer and a method of formation |
| 28 | 7,594,820 | Method and apparatus for electrostatic discharge of connectors |
| 29 | 7,594,321 | Substrate-imprinting methods |
