30 US patents granted on 31 January 2006 and assigned to Intel
| 1 | 6,993,742 | Thermal proximity effects in lithography |
| 2 | 6,993,634 | Active tracking and retrieval of shared memory resource information |
| 3 | 6,993,613 | Methods and apparatus for reducing receive interrupts via paced ingress indication |
| 4 | 6,993,611 | Enhanced general input/output architecture and related methods for establishing virtual channels therein |
| 5 | 6,993,608 | Apparatus and methods for keyboard data normalization |
| 6 | 6,993,602 | Configuring queues based on a given parameter |
| 7 | 6,993,599 | Efficient command delivery and data transfer |
| 8 | 6,993,540 | Prefetching memory objects into a shared cache during garbage collection with a three-finger Cheney scan in a multithreaded processing environment |
| 9 | 6,993,468 | Recognizing signals in design simulation |
| 10 | 6,993,295 | Weaver image reject mixer with fine resolution frequency step size |
| 11 | 6,993,212 | Optical waveguide devices having adjustable waveguide cladding |
| 12 | 6,993,057 | Coarse spectrometer with a grating |
| 13 | 6,993,032 | Buffer arrangements to support differential link distances at full bandwidth |
| 14 | 6,993,020 | Distributed switch memory architecture |
| 15 | 6,992,899 | Power delivery apparatus, systems, and methods |
| 16 | 6,992,891 | Metal ball attachment of heat dissipation devices |
| 17 | 6,992,709 | Method and apparatus for high-speed broadband illuminant discrimination |
| 18 | 6,992,619 | Use of global positioning satellites (GPS) to discover and select local services |
| 19 | 6,992,603 | Single-stage and multi-stage low power interconnect architectures |
| 20 | 6,992,405 | Dynamic voltage scaling scheme for an on-die voltage differentiator design |
| 21 | 6,992,391 | Dual-damascene interconnects without an etch stop layer by alternating ILDs |
| 22 | 6,992,387 | Capacitor-related systems for addressing package/motherboard resonance |
| 23 | 6,992,382 | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon |
| 24 | 6,992,381 | Using external radiators with electroosmotic pumps for cooling integrated circuits |
| 25 | 6,992,378 | Socket and package power/ground bar apparatus that increases current carrying capacity resulting in higher IC power delivery |
| 26 | 6,992,376 | Electronic package having a folded package substrate |
| 27 | 6,992,373 | Stacked land grid array package |
| 28 | 6,992,339 | Asymmetric memory cell |
| 29 | 6,991,893 | Controlling resist profiles through substrate modification |
| 30 | 6,991,892 | Methods of making an integrated waveguide photodetector |
