30 US patents granted on 03 January 2006 and assigned to Micron
| 1 | 6,983,406 | Method and system for partial-scan testing of integrated circuits |
| 2 | 6,983,404 | Method and apparatus for checking the resistance of programmable elements |
| 3 | 6,983,372 | BIOS lock CD-ROM encode/decode driver |
| 4 | 6,983,360 | Program loading mechanism through a single input data path |
| 5 | 6,983,354 | Memory device sequencer and method supporting multiple memory device clock speeds |
| 6 | 6,982,921 | Multiple configuration multiple chip memory device and method |
| 7 | 6,982,920 | Flash array implementation with local and global bit lines |
| 8 | 6,982,905 | Method and apparatus for reading NAND flash memory array |
| 9 | 6,982,894 | Three-dimensional magnetic memory array with a minimal number of access conductors therein and methods thereof |
| 10 | 6,982,892 | Apparatus and methods for a physical layout of simultaneously sub-accessible memory modules |
| 11 | 6,982,869 | Folded interposer |
| 12 | 6,982,758 | Flexy-power amplifier: a new amplifier with built-in power management |
| 13 | 6,982,579 | Digital frequency-multiplying DLLs |
| 14 | 6,982,578 | Digital delay-locked loop circuits with hierarchical delay adjustment |
| 15 | 6,982,572 | Digital logic devices with extremely skewed trip points and reset circuitry for rapidly propagating signal edges, circuits and systems including same |
| 16 | 6,982,565 | Test system and test method with interconnect having semiconductor spring contacts |
| 17 | 6,982,564 | Semiconductor test interconnect with variable flexure contacts |
| 18 | 6,982,486 | Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same |
| 19 | 6,982,457 | Semiconductor devices, and electronic systems comprising semiconductor devices |
| 20 | 6,982,450 | Magnetoresistive memory devices |
| 21 | 6,982,449 | Junction-isolated depletion mode ferroelectric memory devices |
| 22 | 6,982,386 | Interconnecting substrates for electrical coupling of microelectronic components |
| 23 | 6,982,228 | Methods of etching a contact opening over a node location on a semiconductor substrate |
| 24 | 6,982,207 | Methods for filling high aspect ratio trenches in semiconductor layers |
| 25 | 6,982,203 | Method of fabricating integrated circuitry |
| 26 | 6,982,191 | Methods relating to forming interconnects and resulting assemblies |
| 27 | 6,982,177 | Method for in-line testing of flip-chip semiconductor assemblies |
| 28 | 6,982,103 | Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer |
| 29 | 6,981,904 | Anodically-bonded elements for flat panel displays |
| 30 | 6,981,629 | Apparatus of clamping semiconductor devices using sliding finger supports |
