26 US patents granted on 14 August 2007 and assigned to Micron
1 | 7,257,697 | Processing system with general purpose execution unit and separate independently operating data string manipulation unit |
2 | 7,257,683 | Memory arbitration system and method having an arbitration packet protocol |
3 | 7,257,670 | Multipurpose CAM circuit |
4 | 7,257,667 | Status register to improve initialization of a synchronous memory |
5 | 7,257,043 | Isolation device over field in a memory device |
6 | 7,257,024 | Minimizing adjacent wordline disturb in a memory device |
7 | 7,257,022 | Nanocrystal write once read only memory for archival storage |
8 | 7,256,643 | Device and method for generating a low-voltage reference |
9 | 7,256,595 | Test sockets, test systems, and methods for testing microfeature devices |
10 | 7,256,490 | Test carrier for semiconductor components having conductors defined by grooves |
11 | 7,256,452 | NROM memory device with a high-permittivity gate dielectric formed by the low temperature oxidation of metals |
12 | 7,256,451 | NROM memory device with a high-permittivity gate dielectric formed by the low temperature oxidation of metals |
13 | 7,256,450 | NROM memory device with a high-permittivity gate dielectric formed by the low temperature oxidation of metals |
14 | 7,256,138 | Method and composition for selectively etching against cobalt silicide |
15 | 7,256,123 | Method of forming an interface for a semiconductor device |
16 | 7,256,116 | Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts |
17 | 7,256,115 | Asymmetric plating |
18 | 7,256,074 | Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
19 | 7,256,069 | Wafer-level package and methods of fabricating |
20 | 7,256,068 | Semiconductor package assembly and method for electrically isolating modules |
21 | 7,255,803 | Method of forming contact openings |
22 | 7,255,802 | Tape substrate and method for fabricating the same |
23 | 7,255,630 | Methods of manufacturing carrier heads for polishing micro-device workpieces |
24 | 7,255,273 | Descriptor for identifying a defective die site |
25 | 7,255,128 | System and method for detecting flow in a mass flow controller |
26 | RE39,768 | VCC pump for CMOS imagers |