26 US patents granted on 17 July 2007 and assigned to Micron
| 1 | 7,245,785 | Suppression of ringing artifacts during image resizing |
| 2 | 7,245,553 | Memory system and method for strobing data, command and address signals |
| 3 | 7,245,551 | Read command triggered synchronization circuitry |
| 4 | 7,245,550 | Memory array decoder |
| 5 | 7,245,548 | Techniques for reducing leakage current in memory devices |
| 6 | 7,245,541 | Active termination control |
| 7 | 7,245,540 | Controller for delay locked loop circuits |
| 8 | 7,245,538 | High voltage generation and regulation circuit in a memory device |
| 9 | 7,245,321 | Readout circuit with gain and analog-to-digital conversion for image sensor |
| 10 | 7,245,320 | Method and apparatus for automatic gain and exposure control for maintaining target image brightness in video imager systems |
| 11 | 7,245,300 | Architecture for real-time texture look-up’s for volume rendering |
| 12 | 7,245,145 | Memory module and method having improved signal routing topology |
| 13 | 7,245,136 | Methods of processing a workpiece, methods of communicating signals with respect to a wafer, and methods of communicating signals within a workpiece processing apparatus |
| 14 | 7,245,010 | System and device including a barrier layer |
| 15 | 7,244,987 | NROM flash memory devices on ultrathin silicon |
| 16 | 7,244,981 | Scalable high performance non-volatile memory cells using multi-mechanism carrier transport |
| 17 | 7,244,918 | Method and apparatus providing a two-way shared storage gate on a four-way shared pixel |
| 18 | 7,244,682 | Methods of removing metal-containing materials |
| 19 | 7,244,681 | Methods for selective removal of material from wafer alignment marks |
| 20 | 7,244,678 | Methods for planarization of Group VIII metal-containing surfaces using complexing agents |
| 21 | 7,244,665 | Wafer edge ring structures and methods of formation |
| 22 | 7,244,663 | Wafer reinforcement structure and methods of fabrication |
| 23 | 7,244,659 | Integrated circuits and methods of forming a field effect transistor |
| 24 | 7,244,648 | Methods of forming semiconductor constructions |
| 25 | 7,244,646 | Pixel design to improve photodiode capacitance and method of forming same |
| 26 | 7,244,637 | Chip on board and heat sink attachment methods |
