31 US patents granted on 18 April 2006 and assigned to Micron
| 1 | 7,032,199 | Design rule checking integrated circuits |
| 2 | 7,031,232 | Linear optical disk changer with side switching capabilities |
| 3 | 7,031,215 | Memory device and method having data path with multiple prefetch I/O configurations |
| 4 | 7,030,732 | System and method for locating individuals and equipment, airline reservation system, communication system |
| 5 | 7,030,725 | Semiconductor device with electrically coupled spiral inductors |
| 6 | 7,030,674 | Multiphase clock generators |
| 7 | 7,030,640 | Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
| 8 | 7,030,632 | Compliant contract structures, contactor cards and test system including same |
| 9 | 7,030,603 | Apparatuses and methods for monitoring rotation of a conductive microfeature workpiece |
| 10 | 7,030,499 | Semiconductor constructions |
| 11 | 7,030,458 | Gate dielectric antifuse circuits and methods for operating same |
| 12 | 7,030,436 | Embedded DRAM gain memory cell having MOS transistor body provided with a bi-polar transistor charge injecting means |
| 13 | 7,030,410 | Resistance variable device |
| 14 | 7,030,405 | Method and apparatus for resistance variable material cells |
| 15 | 7,030,042 | Systems and methods for forming tantalum oxide layers and tantalum precursor compounds |
| 16 | 7,030,037 | Atomic layer deposition apparatus and method |
| 17 | 7,030,034 | Methods of etching silicon nitride substantially selectively relative to an oxide of aluminum |
| 18 | 7,030,014 | Semiconductor constructions and electronic systems comprising metal silicide |
| 19 | 7,030,010 | Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures |
| 20 | 7,029,985 | Method of forming MIS capacitor |
| 21 | 7,029,963 | Semiconductor damascene trench and methods thereof |
| 22 | 7,029,954 | Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same |
| 23 | 7,029,949 | Method for fabricating encapsulated semiconductor components having conductive vias |
| 24 | 7,029,931 | Stacked die module and techniques for forming a stacked die module |
| 25 | 7,029,926 | Double density MRAM with planar processing |
| 26 | 7,029,923 | Method for manufacture of magneto-resistive bit structure |
| 27 | 7,029,592 | Coated beads and process utilizing such beads for forming an etch mask having a discontinuous regular pattern |
| 28 | 7,029,537 | Method of processing selected surfaces in a semiconductor process chamber based on a temperature differential between surfaces |
| 29 | 7,029,266 | Methods and apparatuses for shaping a printed circuit board |
| 30 | 7,029,256 | Leadframe and method for removing cleaning compound flash from mold vents |
| 31 | 7,028,879 | System for depositing connection sites on micro C-4 semiconductor die |
