Micron patents granted on 28 August 2007

36 US patents granted on 28 August 2007 and assigned to Micron

1 7,263,570 Method of providing an interface to a plurality of peripheral devices using bus adapter chips
2 7,263,543 Method for manipulating data in a group of processing elements to transpose the data using a memory stack
3 7,263,022 No-precharge FAMOS cell and latch circuit in a memory device
4 7,263,017 AC sensing for a resistive memory
5 7,263,006 Memory block erasing in a flash memory device
6 7,262,996 Programmable soft-start control for charge pump
7 7,262,780 Simple and robust color saturation adjustment for digital images
8 7,262,641 Current differential buffer
9 7,262,637 Output buffer and method having a supply voltage insensitive slew rate
10 7,262,612 Methods for evaluating characteristics of a plasma or the effects of a plasma on a substrate
11 7,262,555 Method and system for discretely controllable plasma processing
12 7,262,506 Stacked mass storage flash memory package
13 7,262,505 Selective electroless-plated copper metallization
14 7,262,503 Semiconductor constructions
15 7,262,499 Semiconductor packages
16 7,262,488 Substrate with enhanced properties for planarization
17 7,262,487 Semiconductor devices and other electronic components including porous insulators created from “void” creating materials
18 7,262,482 Open pattern inductor
19 7,262,473 Metal to polysilicon contact in oxygen environment
20 7,262,428 Strained Si/SiGe/SOI islands and processes of making same
21 7,262,405 Prefabricated housings for microelectronic imagers
22 7,262,136 Modified facet etch to prevent blown gate oxide and increase etch chamber life
23 7,262,135 Methods of forming layers
24 7,262,134 Microfeature workpieces and methods for forming interconnects in microfeature workpieces
25 7,262,132 Metal plating using seed film
26 7,262,130 Methods for making integrated-circuit wiring from copper, silver, gold, and other metals
27 7,262,123 Methods of forming wire bonds for semiconductor constructions
28 7,262,121 Integrated circuit and methods of redistributing bondpad locations
29 7,262,110 Trench isolation structure and method of formation
30 7,262,102 Reduction of field edge thinning in peripheral devices
31 7,262,099 Methods of forming field effect transistors
32 7,262,089 Methods of forming semiconductor structures
33 7,262,074 Methods of fabricating underfilled, encapsulated semiconductor die assemblies
34 7,262,053 Terraced film stack
35 7,261,835 Acid blend for removing etch residue
36 7,261,832 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies